USB2.0 RG2300A Core SO-DIMM Form Factor
TheUSB 2.0 RG2300A Core module is available in an easy-to-integrate pluggableSO-DIMM form factor and supports extension of up to 100m over CAT 5e (orbetter), up to 500m over multimode fiber, and up to 10km over single modefiber. It provides for direct connectivity in MII, GMII, RGMII or TBI modes,and is optimized for mass storage throughout speeds.
Overview
TheUSB 2.0 RG2300A Core module continues the tradition of being the most robustand reliable embedded USB 2.0 extender module on the market. Available in aneasy-to-integrate pluggable SO-DIMM form factor, the RG2300A Core supportsdirect USB 2.0 extension connectivity of up to 100m over CAT 5e (or better) and10km over fiber. It is optimized for mass storage throughput speeds andboasts market leading USB device and host compatibility.
Toassist developers with their OEM projects, the USB 2.0RG2300A Core Developer Kit provides a rapid means to evaluatethe RG2300A Core in your application and to prototype custom solutions. For USBover LAN connections and more advanced capabilities, please consider the RG2310ACore .
Features
USB 2.0 throughputs up to 480Mbps
USB extension over copper and fiber
Interoperability with RG2304 series of extenders
Extend up to 31 USB devices (including hubs)
Pin-for-pin compatibility with existing RG2100 Core hardware designs
Ask your sales representative for additional features that maymeet your specific requirements
Includes the ExtremeUSB® suite of features:
Transparent USB extension
True plug and play; no software drivers required
Works with all major operating systems: Windows®, Mac OS X®, and Linux®
Specifications
MAXIMUMRANGE
PHYSICAL
PCB Dimensions: 67.60mm x 31.75mm, PCB Thickness: 1.0mm +/- 0.1mm
Max PCBA Height: Top: 2.5mm +/- 0.2mm, Bottom 1.1mm +/- 0.1mm
Mounting Holes: 4.00mm +/- 0.10mm Diameter
Connector: 1.8V Standard Keyed 200pin SO-DIMM
ENVIRONMENTAL
Operating Temperature: 0°C to 50°C (32°F to 122°F)
Storage Temperature: -20°C to 70°C (-4°F to 158°F)
Operating Humidity (non-condensing): 20% to 80% relative humidity
Storage Humidity (non-condensing): 10% to 90% relative humidity
POWER
USBSUPPORT
USB Speeds: Low-speed, Full-speed, High-speed
Max Throughput: Up to 480Mbps
Device Compatibility: All device types and hubs
Host Compatibility: OHCI, UHCI, EHCI, xHCI
CONNECTIVITY
INTERFACES
§ Broadcom BCM5481, BCM54616 (GMII)
§ Realtek RTL8211 (GMII, RGMII)
§ Texas Instruments TLK1221 (TBI)